Date: February 22 , 2012

Company History

1991: TELCO SRL is founded. The products which turned quickly the company name into a trademark on Romanian market were the electronic taxicab taximeters. Market rate - 60 %; the taximeter model developed by TELCO SRL was the first one in Romania to be certified by the National Institute of Metrology; other products : water consumption counters, audio equipments, thermoregulators.

1994: The company splits, a new company specialized in electronic equipments manufacturing, TELCO EFTC SRL, emerges from the old one, having the same partnership; the specific activities are design, manufacturing and trading of general purpose electronic equipments, batch and medium series, in through-hole technology

1999: TELCO SRL started a cooperation with the german company Pantel Elektronik GmbH based on manufacturing and trading electronic equipments designated for electro-domestic industry as well as audio and general purpose devices, in medium and large series; a first lead wave THT soldering line is installed.

2000: The ISO 9001/2000 Certification by german DQS company; till nowadays re-certification was rigorously, regularly obtained on yearly basis.

2003: The manufacturing profile includes also electronic products designated to the automotive industry; a second manufacturing facility is opened on a distinct location :it's the automatic electronic assembling division; the manufacturing capabilities include radial and axial electronic components automatic assembling machines as well as a first automatic SMT components assembling line (Casio).

2005: The prototype department is born; its assignment consists in original-branded products development; its manufacturing capabilities are 3D milling and a SMT component pick & place, dispenser equipped, automatic machine (Autotronik), specially prototype designated

2006: The RoHS components compatible technology is implemented and a liquid varnish coating machine is installed.

2007: The second automatic SMT components assembling line (Samsung) and a new lead-free wave THT soldering line are installed ; from this point there are two separate wave soldering lines : lead and lead-free.

2008: The company has expanded the design and manufacturing capabilities in a wide range, from simple electronic boards up to complex, sophisticated mixed SMT+THT technology equipments, either lead or lead-free processing, with or without any mechanical sub-assemblies.
The company dwells in two fully renovated, upgraded buildings, having all the necessary technical, functional and environmental facilities.These provide a working environment according to all specific standards (fully ESD area implied) and to all current exigencies.

2010: The company moves to a new location, Str. Cpt. Damsescu Nr.46, in a 2 floor building with a total surface of 5000 m2.
Two new SMD assembly lines are aquired doubling the SMD assembling capacity.

2011: A new coating department is being developed within the company.